Food, Beverage and Dairy
Food, Beverage and Dairy

TSMF Temperature Sensors Mini

Temperature Sensors, CIP Controls, IO-Link

Mini sensor series of the new TS generation: extremely flexible, modular, user-configurable │ with IO-Link

  • Flex hybrid technology with a digital and analog interface (IO-Link + 4…20 mA)
  • Superior quality level in temperature range, measuring accuracy and temperature resistance
  • One-piece design entirely in stainless steel for maximum long-term stability and application reliability
  • Consistent modular design for easy individual configuration
  • Flex-Hybrid technology offers maximum flexibility and future compatibility in new installations
  • For retrofitting in existing installations, any mini-sensor of the TFP series can be replaced – with all the additional advantages
  • A suitable model is always available for replacement of third-party devices
  • All details about IO-Link properties, parameters, diagnostics, events and more can be found in the IODDViewer. Just click here.
  • Add-On Instructions (AOI) are available at

TS is the fully compatible successor of the existing TFP series

Click here to find out which TS sensor corresponds to the TFP sensor (PDF).

Key Benefits:
Product Information:

Technical Specification

Process Connection CLEANadapt │ Tri-Clamp │ Varivent │ FLEXadapt ESF │ Thread | Without thread
Insertion length 0…2000 mm (flush version available)
Wetted material Stainless steel 1.4404 (AISI 316L) │ PEEK (Dependent on type )
Measuring range -200 °C …+400 °C
Accuracy < ±0.1 °C/°F
Available versions Head Ø18 mm │ Spacer │ Transmitter
Operating pressure max. 50 bar | 10 bar (Dependent on type )
Communication 4…20 mA, IO-Link
The values shown are the performance limits within the product line. The product-specific data for each individual configuration can be obtained from the product information



Temperature sensor TS: Overview of configuration options

Configuration with IO-Link


Key Benefits:
Product Information:
User Manuals:

Process Connection

Configuration and 3D Data